The AD7888 is a high speed, low power, 12-bit ADC that operates from a single +2.7 V to +5.25 V power supply. The AD7888 is capable of a 125 kSPS throughput rate. The input track-andhold acquires a signal in 500 ns and features a single-ended sampling scheme. The AD7888 contains eight single-ended analog inputs, AIN1 through AIN8. The analog input on each of these channels is from 0 to VREF. The part is capable of converting full power signals up to 2.5 MHz.
The AD7888 features an on-chip 2.5 V reference that can be used as the reference source for the A/D converter. The REF IN/REF OUT pin allows the user access to this reference. Alternatively, this pin can be overdriven to provide an external reference voltage for the AD7888. The voltage range for this external reference is from 1.2 V to VDD.
CMOS construction ensures low power dissipation of typically 2 mW for normal operation and 3 mW in power-down mode. The part is available in a 16-lead narrow body small outline (SOIC) and a 16-lead thin shrink small outline (TSSOP) package.
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Battery-Powered Systems (Personal Digital Assistants, Medical Instruments, Mobile Communications)Instrumentation and Control SystemsHigh Speed Modems
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Specified for VDD of +2.7 V to +5.25 VFlexible Power/Throughput Rate ManagementShutdown Mode: 1 A MaxEight Single-Ended InputsSerial Interface: SPI™/QSPI™/MICROWIRE™/DSP Compatible16-Lead Narrow SOIC and TSSOP Packages
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(TA = +25°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . ..0.3 V to +7 V
Analog Input Voltage to AGND . . . . . ...0.3 V to VDD + 0.3 V
Digital Input Voltage to AGND . . . . . ... 0.3 V to VDD + 0.3 V
Digital Output Voltage to AGND . . . . ...0.3 V to VDD + 0.3 V
REFIN/REFOUT to AGND . . . . . . . . .......0.3 V to VDD + 0.3 V
Input Current to Any Pin Except Supplies2 . . . . . . . . ±10 mA
Operating Temperature Range
Commercial
(A Version) . . . . . . . . . . . . . . . . . . . 40°C to +105°C
(B Version) . . . . . . . . . . . . . . . . . . . . . . 0°C to +105°C
Storage Temperature Range . . . . . . . . 65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
SOIC, TSSOP Package, Power Dissipation . . . . . . . . ..450 mW
JA Thermal Impedance . . . . . . . . . . . . 124.9°C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 150.4°C/W (TSSOP)
JC Thermal Impedance . . . . . . . . . . . . . 42.9°C/W (SOIC)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... 27.6°C/W (TSSOP)
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . .. . . +215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... 1.5 kV
Post a Buying Lead
Required Field 
